SN74LVT1253.3ĆV ABT QUADRUPLE BUS BUFFERWITH 3ĆSTATE OUTPUTSSCBS133F − MAY 1992 − REVISED OCTOBER 2003DSupports Mixed-Mode Signal OperationDDDDDD (5-V Input and Output Voltages With3.3-V VCC)Supports Unregulated Battery OperationDown to 2.7 VTypical VOLP (Output Ground Bounce)<0.8 V at VCC = 3.3 V, TA = 25°CIoff Supports Partial-Power-Down ModeOperationBus-Hold Data Inputs Eliminate the Needfor External Pullup ResistorsLatch-Up Performance Exceeds 500 mAPer JEDEC Standard JESD-17ESD Protection Exceeds JESD 22− 2000-V Human-Body Model (A114-A)− 200-V Machine Model (A115-A)D, DB, NS, OR PW PACKAGE(TOP VIEW)1OE1A1Y2OE2A2YGND1234567141312111098VCC4OE4A4Y3OE3A3Ydescription/ordering informationThis bus buffer is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to providea TTL interface to a 5-V system environment.The SN74LVT125 features independent line drivers with 3-state outputs. Each output is in the high-impedancestate when the associated output-enable (OE) input is high.Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistorswith the bus-hold circuitry is not recommended.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.ORDERING INFORMATIONTASOIC − D−40°C to 85°CSOP − NSSSOP − DBTSSOP − PWPACKAGE†TubeTape and reelTape and reelTape and reelTubeTape and reelORDERABLEPART NUMBERSN74LVT125DSN74LVT125DRSN74LVT125NSRSN74LVT125DBRSN74LVT125PWSN74LVT125PWRTOP-SIDEMARKINGLVT125LVT125LX125LX125†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelinesare available at www.ti.com/sc/package.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.Copyright 2003, Texas Instruments IncorporatedPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•1元器件交易网www.cecb2b.com
SCBS133F − MAY 1992 − REVISED OCTOBER 2003SN74LVT1253.3ĆV ABT QUADRUPLE BUS BUFFERWITH 3ĆSTATE OUTPUTSFUNCTION TABLE(each buffer)INPUTSOELLHAHLXOUTPUTYHLZlogic diagram (positive logic)1OE1A1245631Y2OE2A2Y3OE3A10983Y4OE4A1312114Yabsolute maximum ratings over operating free-air temperature range (unless otherwise noted)†Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 VInput voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 VVoltage range applied to any output in the high state or power-off state, VO (see Note 1) . . . . −0.5 V to 7 VCurrent into any output in the low state, IO 128 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . mACurrent into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mAInput clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mAOutput clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mAPackage thermal impedance, θJA (see Note 3):D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/WDB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/WNS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/WPW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/WStorage temperature range, Tstg −65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C to 150°C†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES:1.The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.2.This current flows only when the output is in the high state and VO > VCC.3.The package thermal impedance is calculated in accordance with JESD 51-7.2POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com
SN74LVT1253.3ĆV ABT QUADRUPLE BUS BUFFERWITH 3ĆSTATE OUTPUTSSCBS133F − MAY 1992 − REVISED OCTOBER 2003recommended operating conditions (see Note 4)MINVCCVIHVILVIIOHIOL∆t/∆vSupply voltageHigh-level input voltageLow-level input voltageInput voltageHigh-level output currentLow-level output currentInput transition rise or fall rateOutputs enabled2.720.85.5−326410MAX3.6UNITVVVVmAmAns/VTAOperating free-air temperature−4085°CNOTE 4:All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.electrical characteristics over recommended operating free-air temperature range (unlessotherwise noted)PARAMETERVIKVOHVCC = 2.7 V,VCC = MIN to MAX‡,VCC = 2.7 V,VCC = 3 VVCC = 2.7 VVOLVCC = 3 VVCC = 0 or MAX‡,IIVCC = 3.6 VVCC = 0,VCC = 3 VVCC = 3.6 V,VCC = 3.6 V,VCC = 3.6 V,VI = VCC or GNDVCC = 3 V to 3.6 V,VI = 3 V or 0VO = 3 V or 0TEST CONDITIONSII = −18 mAIOH = −100 µAIOH = −8 mAIOH = −32 mAIOL = 100 µAIOL = 24 mAIOL = 16 mAIOL = 32 mAIOL = 64 mAVI = 5.5 VVI = VCC or GNDVI = VCCVI = 0VI or VO = 0 to 4.5 VVI = 0.8 VVI = 2 VVO = 3 VVO = 0.5 VOutputs highICC∆ICC§CiCoIO = 0,Outputs lowOutputs disabledOne input at VCC − 0.6 V,Other inputs at VCCor GND480.124.50.12Control inputsData inputsMINVCC−0.22.42 0.20.50.40.50.5510±11−5±100Data inputs75−755−50.1970.190.2mApFpFmAµAµAµAµAµAVTYP†MAX−1.2UNITVVIoffII(hold)IOZHIOZL†All typical values are at VCC = 3.3 V, TA = 25°C.‡For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.§This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.POST OFFICE BOX 655303 DALLAS, TEXAS 75265•3元器件交易网www.cecb2b.com
SCBS133F − MAY 1992 − REVISED OCTOBER 2003SN74LVT1253.3ĆV ABT QUADRUPLE BUS BUFFERWITH 3ĆSTATE OUTPUTSswitching characteristics over recommended operating free-air temperature range, CL = 50 pF(unless otherwise noted) (see Figure 1)PARAMETERtPLHtPHLtPZHtPZLtPHZtPLZFROM(INPUT)AOEOETO(OUTPUT)YYYVCC = 3.3 V± 0.3 VMINTYP†MAX1111.11.81.32.72.93.43.43.72.643.94.74.75.14.5VCC = 2.7 VMINMAX4.54.966.55.74nsnsnsUNIT†All typical values are at VCC = 3.3 V, TA = 25°C.4POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com
SN74LVT1253.3ĆV ABT QUADRUPLE BUS BUFFERWITH 3ĆSTATE OUTPUTSSCBS133F − MAY 1992 − REVISED OCTOBER 2003PARAMETER MEASUREMENT INFORMATION6 VFrom Output Under TestCL = 50 pF(see Note A)500 ΩS1OpenGND500 ΩTESTtPLH/tPHLtPLZ/tPZLtPHZ/tPZHS1Open6 VGNDLOAD CIRCUIT FOR OUTPUTStw2.7 VInput1.5 V1.5 V0 VVOLTAGE WAVEFORMSPULSE DURATION2.7 VInputtPLHOutputtPHLOutput1.5 V1.5 V1.5 V1.5 V0 VtPHL1.5 VtPLHVOH1.5 VVOLVOLTAGE WAVEFORMSPROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOHVOL2.7 VTiming Input1.5 V0 VtsuData Input1.5 Vth2.7 V1.5 V0 VVOLTAGE WAVEFORMSSETUP AND HOLD TIMES2.7 V1.5 VtPZLOutputWaveform 1S1 at 6 V(see Note B)OutputWaveform 2S1 at GND(see Note B)tPZHtPLZ1.5 VtPHZVOH − 0.3 VVOH≈0 VVOLTAGE WAVEFORMSENABLE AND DISABLE TIMESLOW- AND HIGH-LEVEL ENABLING3 VVOL + 0.3 VVOL1.5 V0 VOutputControl1.5 VNOTES:A.CL includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.Waveform2 is for an output with internal conditions such that the output is high except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.D.The outputs are measured one at a time with one transition per measurement.E.All parameters and waveforms are not applicable to all devices.Figure 1. Load Circuit and Voltage WaveformsPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•5元器件交易网www.cecb2b.com
PACKAGEOPTIONADDENDUM
www.ti.com
12-Sep-2006
PACKAGINGINFORMATION
OrderableDeviceSN74LVT125DSN74LVT125DBLESN74LVT125DBRSN74LVT125DBRG4SN74LVT125DG4SN74LVT125DRSN74LVT125DRG4SN74LVT125NSRSN74LVT125PWSN74LVT125PWG4SN74LVT125PWLESN74LVT125PWRSN74LVT125PWRG4
(1)
Status(1)NRNDOBSOLETENRNDNRNDNRNDNRNDNRNDNRNDNRNDNRNDOBSOLETENRNDNRND
PackageTypeSOICSSOPSSOPSSOPSOICSOICSOICSOTSSOPTSSOPTSSOPTSSOPTSSOP
PackageDrawing
DDBDBDBDDDNSPWPWPWPWPW
PinsPackageEcoPlan(2)
Qty14141414141414141414141414
50
Green(RoHS&noSb/Br)
TBD
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)50
Green(RoHS&noSb/Br)
Lead/BallFinishCUNIPDAUCallTICUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCallTICUNIPDAUCUNIPDAU
MSLPeakTemp(3)Level-1-260C-UNLIMCallTI
Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMCallTI
Level-1-260C-UNLIMLevel-1-260C-UNLIM
2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)9090
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
TBD
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)
Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)
EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms\"Lead-Free\"or\"Pb-Free\"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines\"Green\"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)
(3)
MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
Addendum-Page1
元器件交易网www.cecb2b.com
PACKAGEOPTIONADDENDUM
www.ti.com
12-Sep-2006
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
Addendum-Page2
元器件交易网www.cecb2b.com
元器件交易网www.cecb2b.com
元器件交易网www.cecb2b.com
MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**) 28 PINS SHOWN0,65280,380,22150,15MPLASTIC SMALL-OUTLINE0,250,095,605,008,207,40Gage Plane1A140°–ā8°0,250,950,55Seating Plane2,00 MAX0,05 MIN0,10PINS **DIMA MAX146,50166,50207,50248,502810,503010,503812,90A MIN5,905,906,907,909,909,9012,304040065/E 12/01NOTES:A.B.C.D.All linear dimensions are in millimeters.This drawing is subject to change without notice.Body dimensions do not include mold flash or protrusion not to exceed 0,15.Falls within JEDEC MO-150POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 MECHANICAL DATA PW (R-PDSO-G**) 14 PINS SHOWNPLASTIC SMALL-OUTLINE PACKAGE0,651480,300,190,10M0,15 NOM4,504,306,606,20Gage Plane0,251A70°–8°0,750,50Seating Plane1,20 MAX0,150,050,10PINS **DIMA MAX83,10145,10165,10206,60247,90289,80A MIN2,904,904,906,407,709,604040064/F 01/97NOTES:A.B.C.D.All linear dimensions are in millimeters.This drawing is subject to change without notice.Body dimensions do not include mold flash or protrusion not to exceed 0,15.Falls within JEDEC MO-153POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:ProductsAmplifiersData ConvertersDSPInterfaceLogicPower MgmtMicrocontrollers
amplifier.ti.comdataconverter.ti.comdsp.ti.cominterface.ti.comlogic.ti.compower.ti.commicrocontroller.ti.com
ApplicationsAudioAutomotiveBroadbandDigital ControlMilitary
Optical NetworkingSecurityTelephonyVideo & ImagingWireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
www.ti.com/audiowww.ti.com/automotivewww.ti.com/broadbandwww.ti.com/digitalcontrolwww.ti.com/militarywww.ti.com/opticalnetworkwww.ti.com/securitywww.ti.com/telephonywww.ti.com/videowww.ti.com/wireless
Low Power Wirelesswww.ti.com/lpw
因篇幅问题不能全部显示,请点此查看更多更全内容