专利名称：Spunbond facing and faced insulation
assembly
发明人：Ralph Michael Fay,Blake Boyd Bogrett申请号：US11543188申请日：20061004
公开号：US20070026185A1公开日：20070201
专利附图：
摘要：A faced building insulation assembly includes a first facing forming a first majorsurface of the assembly with a central field portion having one or more spunbondcontinuous polymeric filament mat layers. Preferably, the facing is fungi growth resistant
and has a selected water vapor permeance rating as applied to an insulation layer of theassembly. The facing may also include one or more polymeric film layers, a fungi growthinhibiting agent, a pesticide, and/or a heat activated bonding agent that bonds the facingto the insulation layer of the assembly. The insulation assembly may also include asecond facing forming a second major surface of the assembly that has a water vaporpermeance rating equal to or differing from the first facing.
申请人：Ralph Michael Fay,Blake Boyd Bogrett
地址：Lakewood CO US,Littleton CO US
国籍：US,US
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