General Purpose Transistor
PNP Silicon
Features
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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COLLECTOR
3MAXIMUM RATINGS
Rating
Collector−Emitter VoltageCollector−Base VoltageEmitter−Base VoltageCollector Current − Continuous
SymbolVCEOVCBOVEBOIC
Value−45−60−5.0−800
UnitVdcVdcVdcmAdc
1BASE2EMITTER
Stresses exceeding Maximum Ratings may damage the device. MaximumRatings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure tostresses above the Recommended Operating Conditions may affect devicereliability.
312SOT−23CASE 318STYLE 6
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board(Note 1) TA = 25°CDerate above 25°CThermal Resistance,Junction−to−AmbientTotal Device Dissipation
Alumina Substrate (Note 2)TA = 25°C
Derate above 25°CThermal Resistance,Junction−to−Ambient
Junction and Storage Temperature
SymbolPD
Max2251.8
RqJAPD
556300
UnitmWmW/°C°C/WmW
DGMG
MARKING DIAGRAM
DG MGG
= Specific Device Code= Date Code*
= Pb−Free Package
2.4
RqJATJ, Tstg
417−55 to +150
mW/°C°C/W°C
(Note: Microdot may be in either location)*Date Code orientation and/or overbar may varydepending upon manufacturing location.
ORDERING INFORMATION
DeviceBCW68GLT1GBCW68GLT3G
PackageSOT−23(Pb−Free)SOT−23(Pb−Free)
Shipping†3000 / Tape & Reel10000 / Tape & Reel
1.FR−5 = 1.0 0.75 0.062 in.
2.Alumina = 0.4 0.3 0.024 in 99.5% alumina.
†For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 5
1
Publication Order Number:
BCW68GLT1/D
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BCW68GLT1G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage (IC = −10 mAdc, IB = 0)Collector−Emitter Breakdown Voltage (IC = −10 mAdc, VEB = 0)Emitter−Base Breakdown Voltage (IE = −10 mAdc, IC = 0)Collector Cutoff Current(VCE= −45 Vdc, IE = 0)
(VCE= −45 Vdc, IB = 0, TA = 150°C)Emitter Cutoff Current (VEB = −4.0 Vdc, IC = 0)ON CHARACTERISTICS
DC Current Gain
(IC = −10 mAdc, VCE = −1.0 Vdc)(IC = −100 mAdc, VCE = −1.0 Vdc)(IC = −300 mAdc, VCE = −1.0 Vdc)
Collector−Emitter Saturation Voltage (IC = −300 mAdc, IB = −30 mAdc)Base−Emitter Saturation Voltage (IC = −500 mAdc, IB = −50 mAdc)SMALL−SIGNAL CHARACTERISTICSCurrent−Gain − Bandwidth Product
(IC = −20 mAdc, VCE = −10 Vdc, f = 100 MHz)Output Capacitance
(VCB= −10 Vdc, IE = 0, f = 1.0 MHz)Input Capacitance
(VEB= −0.5 Vdc, IC = 0, f = 1.0 MHz)
Noise Figure
(IC= −0.2 mAdc, VCE = −5.0 Vdc, RS = 1.0 kW, f = 1.0 kHz, BW = 200 Hz)
fTCoboCiboNF
100−−−
−−−−
−1810510
MHzpFpFdB
hFE
−
12016060−−
−−−−−
400−−−1.5−2.0
VdcVdc
V(BR)CEOV(BR)CESV(BR)EBOICES
−45−60−5.0−−−
−−−−−−
−−−−20−10−20
VdcVdcVdcnAdcmAdcnAdc
Symbol
Min
Typ
Max
Unit
IEBO
VCE(sat)VBE(sat)
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2
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BCW68GLT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)CASE 318−08ISSUE AN
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: INCH.
3.MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OFBASE MATERIAL.
4.318−01 THRU −07 AND −09 OBSOLETE, NEWSTANDARD 318−08.
DSEE VIEW C3E12HEcebq0.25AA1LL1VIEW C
DIMAA1bcDEeLL1HEMIN0.890.010.370.092.801.201.780.100.352.10MILLIMETERSNOMMAX1.001.110.060.100.440.500.130.182.903.041.301.401.902.040.200.300.540.692.402.64MIN0.0350.0010.0150.0030.1100.0470.0700.0040.0140.083INCHESNOM0.0400.0020.0180.0050.1140.0510.0750.0080.0210.094MAX0.0440.0040.0200.0070.1200.0550.0810.0120.0290.104STYLE 6:
PIN 1.BASE
2.EMITTER3.COLLECTOR
SOLDERING FOOTPRINT*
0.950.0370.950.0372.00.0790.90.0350.80.031SCALE 10:1
mmǓǒinches*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume anyliability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidentaldamages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary overtime. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license underits patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or deathmay occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim ofpersonal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 303−675−2175 or 800−344−3860 Toll Free USA/CanadaFax: 303−675−2176 or 800−344−3867 Toll Free USA/CanadaEmail: orderlit@onsemi.comN. American Technical Support: 800−282−9855 Toll FreeUSA/CanadaEurope, Middle East and Africa Technical Support:Phone: 421 33 790 2910Japan Customer Focus CenterPhone: 81−3−5773−3850ON Semiconductor Website: www.onsemi.comOrder Literature: http://www.onsemi.com/orderlitFor additional information, please contact your locaSales Representativehttp://onsemi.com3BCW68GLT1/Dhttp://oneic.com/
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