MULTICHIP MODULE, PRINTED CIRCUIT BOARD UNIT, AND

专利名称：MULTICHIP MODULE, PRINTED CIRCUIT

BOARD UNIT, AND ELECTRONICAPPARATUS

发明人：Takayoshi MATSUMURA,Kenji Kobae,Shuichi

Takeuchi,Tetsuya Takahashi

申请号：US12821938申请日：20100623

公开号：US20100328917A1公开日：20101230

专利附图：

摘要：A multichip module includes a package substrate, a first semiconductor device, a

second semiconductor device and a conductive bump. The first semiconductor device isflip-chip bonded to the package substrate. The first semiconductor device includes a firstchip pad on a surface thereof. The second semiconductor device is mounted on the firstsemiconductor device. The second semiconductor device includes a second chip padfacing the first chip pad. The conductive bump connects the first chip pad to the secondchip pad. The conductive bump includes a first metallic body that has a first diffusion rateand a second metallic body that has a second diffusion rate lower than the first diffusionrate.

申请人：Takayoshi MATSUMURA,Kenji Kobae,Shuichi Takeuchi,Tetsuya Takahashi

地址：Kawasaki JP,Kawasaki JP,Kawasaki JP,Kawasaki JP

国籍：JP,JP,JP,JP

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