专利名称：COMPOSITION OF THERMAL INTERFACE
MATERIAL
发明人：Kuo-Chan Chiou,Lu-Shih Liao,Tzong-Ming Lee申请号：US12778665申请日：20100512
公开号：US20100219369A1公开日：20100902
摘要：A composition of a thermal interface material is provided. The deficiencies oflow thermal conductivity and high thermal resistance in the conventional thermalinterface materials are resolved. By using carbon fibers with high thermal conductivity,the thermal conductivity of the thermal interface material can be about 7˜10 times higherthan the traditional thermal interface materials. The added amount of carbon fibers isless than the added amount of metal or ceramic powders. The dispersion process isthereby improved. Further, the thermal interface material has a phase change
temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filledat the normal operation temperature of device to reduce the thermal resistance of theentire device and to increase the interfacial bonding strength.
申请人：Kuo-Chan Chiou,Lu-Shih Liao,Tzong-Ming Lee
地址：Tainan City TW,Taichung City TW,Hsinchu City TW
国籍：TW,TW,TW
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容