专利名称：Solder bump forming method and solder
paste
发明人：宇野 浩規,石川 雅之申请号：JP2017110969申请日：20170605公开号：JP2018206953A公开日：20181227
专利附图：
摘要：Problem to be solved: to provide a solder bump forming method and solderpaste capable of forming a solder bump precisely aligned on an electrode portion andcapable of coping with a fine pitch. Solution: a method of forming a bump bump 3 on a
plurality of electrode portions 2 arranged at a mutual interval on the surface of thesubstrate 1 is a resist layer forming step for forming a resist layer 4 having a plurality ofholes 41 exposing the electrode part 2 on the substrate 1 and half of the outer diameterD of the electrode part A solder paste 30 containing a solder powder and a flux 32 madeup of a plurality of solder particles 31 having a mean particle size s having a meandiameter s less than twice the opening diameter h of the hole portion 41 is formed, andsolderAn embedding printing process for filling the paste 30 into the hole 41, and a heattreatment step for heating the solder paste 30 in the hole 41 to melt the solder particles31 and forming the bump bumps 3 on the electrode portion 2. Diagram
申请人：三菱マテリアル株式会社
地址：東京都千代田区大手町一丁目３番２号
国籍：JP
代理人：青山 正和
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