Thermal grease for Infineon modules
What should be the behavior and how a grease has to look like
Baginski
IFAG AIM PMD ID AE 2007-06-01
Considerations
Infineon modules with baseplate: Roughness of baseplate RZmax. = 16 μm;RZtyp. = 4 – 6 μm Infineon modules without baseplate: Roughness of ceramic RZmax. = 9 μm; RZtyp. = 3 – 4 μm
Heatsink: Specification of roughness regarding Application Note Modules with and without baseplate: RZmax. = 10 μm
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 2
Considerations
Example of roughness of baseplate and heatsink
Baseplate RZtyp. = 6 μm
RZmax. = 10 μm
Heatsink The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 3
Considerations
Thermal conductivity:
Copper: λ ≈ 390 W / mK Aluminium: λ ≈ 237 W / mK
Thermal compound: λ ≈ 1 W / mK
Copper TIM
=> Thermal barrier
Aluminium
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 4
Considerations
Diagram with thermal grease Rth JC Rth CH thermal grease Rth HA R >> R th grease Diagram with thermal grease Rth JC Rth CH Rth CH thermal metall grease Rth HA || R metall th grease
Rth CH metall << Rth CH thermal grease mK/W << 1 mK/W << Rth CH air << 42 mK/W
=> Metal to Metal contact essential
=> Thermal grease that fills only the gapes is prefered
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 5
Considerations
Thermal grease consists of different components Oily parts
Only needed to adjust the viscosity of the grease
Thermal conducting parts
Necessary to conduct baseplate and heatsink together
Baseplate RZtyp. = 6 μm
RZmax. = 10 μm
Heatsink The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 6
Considerations
Thermal interface material: Example for better understanding
Grain size: Up to 70 μm
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 7
Temperature
drop
390 W/mK Small temp. drop
Considerations
Example: Thermal grease with 40 μm size in application
Baseplate
No chance to move
Oily part
1 W/mK Big temp. drop
237 W/mK Small temp. drop
Heat conducting
part
Heatsink
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 8
Considerations
Example of grains of 40 μm size
Grease works like distance spacers
Baseplate
Heatsink
=> RthCH = bad
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 9
Considerations
Example: Thermal grease with 5 μm size in application
Temperature
drop
Baseplate
Heatsink
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 10
Considerations
Example of grains of 5 μm size
Hole to fix module with the heatsink
Baseplate Heatsink
Metal to metal contact possible
=> RthCH = good
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 11
Considerations
Viscosity of thermal grease: High viscosity (hard)
Baseplate
Dots of grease
Heatsink Baseplate Heatsink Permanent gap Baseplate Heatsink The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation. 6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 12
Considerations
Viscosity of thermal grease: Low viscosity (fluid)
Baseplate
Dots of grease
Heatsink Baseplate Heatsink
Grease
comes out
Baseplate Heatsink The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 13
Considerations
Roughness of heatsink
Baseplate RZtyp. = 6 μm
RZmax. = 1 μm
Heatsink
Permanent distance
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 14
Considerations
Roughness of heatsink
Baseplate RZtyp. = 6 μm
RZmax. = 10 μm
Heatsink Crossover possible
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain
functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 15
Considerations of thermal foil
Foil works like distance keeper
Baseplate
Permanent air
-> bad Rth
Heatsink
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 16
Considerations of phase change material
Before first heat up (no phase change)
F=3Nm
F=3Nm
Baseplate Foil works like distance
keeper
Heatsink
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 17
Considerations of phase change material
After heating up (phase change)
F=Nm F=Nm Loose of pressure Baseplate
Foil works like distance
spacers
Heatsink The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 18
Conclusion of considerations
The grease has to fill only the roughness of the baseplate and the roughness of the heatsink
This do not prevent metal to metal contact where possible The grease has to be fluid enough to spread and to flow out This guarantees small thickness of grease between baseplate and heatsink
This guarantees a good thermal contact
The roughness of the heatsink should be under considerations
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 19
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real
application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.
6-Mar-08
Baginski
Copyright ? Infineon Technologies 2006. All rights reserved.
Page 20
因篇幅问题不能全部显示，请点此查看更多更全内容