Thermally enhanced microcircuit package and method

专利名称：Thermally enhanced microcircuit package

and method of forming same

发明人：Charles M. Newton,Carol A.

Gamlen,Raymond C. Rumpf

申请号：US09727140申请日：20001130

公开号：US20020101719A1公开日：20020801

专利附图：

摘要：A thermally enhanced microcircuit package includes a microcircuit packagehaving a microcircuit device cavity that receives a microcircuit device. A

microelectromechanical (MEMS) cooling module is operatively connected to themicrocircuit package and forms a capillary pumped loop cooling circuit having anevaporator, condenser and interconnecting cooling fluid channels for passing vapor andfluid between the evaporator and condenser and evaporating and condensing thecooling fluid. The evaporator is operatively associated with the microcircuit device forcooling the device when in use.

申请人：HARRIS CORPORATION

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