CHIP PACKAGING STRUCTURE OF A PLURALITY OF ASSEMBL

专利名称：CHIP PACKAGING STRUCTURE OF A

PLURALITY OF ASSEMBLIES

发明人：Xiaochun Tan申请号：US14077376申请日：20131112

公开号：US20140159218A1公开日：20140612

专利附图：

摘要：Disclosed herein are chip packaging structures for packaging multiple

assemblies therein. In one embodiment, a chip packaging structure can include: (i) a firstassembly located at a bottom layer of the chip packaging structure; (ii) at least one

second assembly located above the first assembly, where the second assembly iselectrically connected to the first assembly by a plurality of first protruding structureslocated under the second assembly; (iii) at least one third assembly located above thesecond assembly, where the third assembly is electrically connected to the first assemblyby a plurality of second protruding structures located outside of the second assembly;and (iv) where a first portion of the third assembly and the plurality of second protrudingstructures form a bent structure substantially perpendicular to a second portion of thethird assembly.

申请人：Silergy Semiconductor Technology (Hangzhou) LTD

地址：Hangzhou CN

国籍：CN

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