专利名称：Sputtering apparatus
发明人：Heung-Yeol Na,Jong-Won Hong,Seok-Rak
Chang,Ki-Yong Lee
申请号：US12926115申请日：20101027公开号：US08512530B2公开日：20130820
专利附图：
摘要：A sputtering apparatus includes a process chamber having first and secondregions, a metal target inside the process chamber, a target transfer unit inside theprocess chamber, the target transfer unit being configured to move the metal target
between the first and second regions, a substrate holder in the second region of theprocess chamber, and a magnetic assembly in the first region of the process chamber,the magnetic assembly being interposed between the target transfer unit and a wall ofthe process chamber.
申请人：Heung-Yeol Na,Jong-Won Hong,Seok-Rak Chang,Ki-Yong Lee
地址：Yongin KR,Yongin KR,Yongin KR,Yongin KR
国籍：KR,KR,KR,KR
代理机构：Lee & Morse, P.C.
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