专利名称：Microelectronic packaging using arched
solder columns
发明人：Glenn A. Rinne,Philip A. Deane申请号：US09/096754申请日：19980612公开号：US05963793A公开日：19991005
摘要：Microelectronic packages are formed wherein solder bumps on one or moresubstrates are expanded, to thereby extend and contact the second substrate and forma solder connection. The solder bumps are preferably expanded by reflowing additionalsolder into the plurality of solder bumps. The additional solder may be reflowed from anelongated, narrow solder-containing region adjacent the solder bump, into the solderbump. After reflow, the solder bump which extends across a pair of adjacent substratesforms an arched solder column or partial ring of solder between the two substrates.
申请人：MCNC
代理机构：Alston & Bird LLP
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