¡ SemiconductorOLMS-66K Series 16-Bit Microcontroller
This version: Jan. 1998MSM66201/66P201/66207/66P207Previous version: Nov. 1996GENERAL DESCRIPTION
The MSM66201/66207 is a high performance microcontroller that employs OKI original nX-8/200 CPU core. This chip includes a 16-bit CPU, ROM, RAM, I/O ports, multifunction 16-bittimers, 10-bit A/D converter, serial I/O port, and pulse width modulator (PWM). TheMSM66P201/66P207 is the OTP (One-Time Programmable) version of the MSM66201/66207.
FEATURES
•64K address space for program memory•64K address space for data memory•High-speed execution
Minimum cycle for instruction•Powerful instruction set
:Internal ROM :MSM66201
MSM66207
:Internal RAM :MSM66201
MSM66207
16K bytes32K bytes512 bytes1024 bytes
•Abundant addressing modes
•I/O port
Input-output port
:400ns @ 10MHz
:Instruction set superior in orthogonal matrix8/16-bit data transfer instructions8/16-bit arithmetic instructions
Multiplication and division operation instructionsBit manipulation instructionsBit logic instrucitons
ROM table reference instructions:Register addressingPage addressing
Pointing register indirect addressingStack addressing
Immediate value addressing
:5 ports ¥ 8 bits
(Each bit can be assigned to input or output)
Input port:1 port ¥ 8 bits•Built-in multifunctional 16-bit timer:4
Following 4 modes can be set for each timer:Auto-reload timer mode
Clock output modeCapture register modeReal time output mode
•Serial port:1 channel (Synchronous/UART switchable
mode with baud rate generators)
•16-bit pulse width modulator:2•Watchdog timer•Transition detector:4•10-bit A/D converter:8 channels•Interrupts
Nonmaskable:1Maskable:Internal 16/external 2•Stand-by function
STOP mode:Software clock stop modeHALT mode:Software CPU stop modeHOLD mode:Hardware CPU stop mode
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¡ Semiconductor
•Package
64-pin plastic shrink DIP (SDIP64-P-750-1.78)MSM66201/66P201/66207/66P207
:(MSM66201-¥¥¥SS) (MSM66P201-¥¥¥SS)(MSM66207-¥¥¥SS) (MSM66P207-¥¥¥SS)
64-pin plastic QFP (QFP64-P-1414-0.80-BK):(MSM66201-¥¥¥GSBK)(MSM66207¥¥¥GS-BK)
68-pin plastic QFJ (PLCC) (QFJ68-P-S950-1.27):(MSM66201-¥¥¥JS) (MSM66P201-¥¥¥JS)
(MSM66207-¥¥¥JS) (MSM66P207-¥¥¥JS)
64-pin ceramic piggyback (ADIP64-C-750-1.78):(MSM66G207VS)
(¥¥¥ indicates the code number.)
*
The piggyback type is used only for engineering samples.
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P4.0/TM0CKP4.1/TM1CKP3.4/TM0IOSSPLRBTIMER0–3P3.7/TM3IOEAREADYALEPSENRDWRBLOCK DIAGRAM
¡ Semiconductor
P3.1/RXDP3.0/TXDP2.7/RXCP2.6/TXC*2PSWRAM1024 ¥ 8 bitsSERIALPORTP4.4/TRNS0P4.7/TRNS3MEMORYCONT.PCRAP*1ROM32K ¥ 8 bitsIRINSTRUCTIONDECODERALUACCUMULATORTEMPORARYR.CONSTANTSCONT.TRANSI-TION D.VREFP5.0/AI 0ALUBUS PORTP5.7/AI 7AGNDA/DCONV.AD0/P0.0AD7/P0.7A8 /P1.0A15/P1.7CONT.P4.2/PWM0P4.3/PWM1PWM0,1NMIP3.2/INT0 P3.3/INT1INTERRUPTCONT.P2.3/CLKOUTRESOUTPERIPHERALCONT.WDTSYSTEMCONTROLLERPORT*1MSM6620116K ¥ 8*2MSM66201512 ¥ 8P2P3P4P5P0P1MSM66201/66P201/66207/66P207
FLTRESOSC1OSC0HLDA/P2.5HOLD/P2.4GNDVDD3/30
¡ SemiconductorMSM66201/66P201/66207/66P207
PIN CONFIGURATION (TOP VIEW)
AD0/P0.0164VDDAD1/P0.1263VREFAD2/P0.2362AGNDAD3/P0.3461P5.7/AI7AD4/P0.4560P5.6/AI6AD5/P0.5659P5.5/AI5AD6/P0.6758P5.4/AI4AD7/P0.7857P5.3/AI3A8/P1.0956P5.2/AI2A9/P1.11055P5.1/AI1A10/P1.21154P5.0/AI0A11/P1.31253P4.7/TRNS3A12/P1.41352P4.6/TRNS2A13/P1.51451P4.5/TRNS1A14/P1.61550P4.4/TRNS0A15/P1.71649P4.3/PWM1P2.01748P4.2/PWM0P2.11847P4.1/TM1CKP2.21946P4.0/TM0CKCLKOUT/P2.32045P3.7/TM3IORESOUT2144P3.6/TM2IOALE2243P3.5/TM1IOPSEN2342P3.4/TM0IORD2441P3.3/INT1WR2540P3.2/INT0READY2639P3.1/RXDEA2738P3.0/TXDFLT2837P2.7/RXCRES2936P2.6/TXCOSC03035P2.5/HLDAOSC13134P2.4/HOLDGND3233NMI64-Pin Plastic Shrink DIP
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¡ SemiconductorMSM66201/66P201/66207/66P207
PIN CONFIGURATION (TOP VIEW) (Continued)
64P0.7/AD763P0.6/AD662P0.5/AD561P0.4/AD460P0.3/AD359P0.2/AD258P0.1/AD157P0.0/AD053P5.7/AI752P5.6/AI654P5.5/AI550P5.4/AI449P5.3/AI348P5.2/AI247P5.1/AI146P5.0/AI045P4.7/TRNS344P4.6/TRNS243P4.5/TRNS142P4.4/TRNS041P4.3/PWM140P4.2/PWM039P4.1/TM1CK38P4.0/TM0CK37P3.7/TM3IO36P3.6/TM2IO35P3.5/TM1IO34P3.4/TM0IO33P3.3/INT1INT0/P3.232A8/P1.0A9/P1.1A10/P1.2A11/P1.3A12/P1.4A13/P1.5A14/P1.6A15/P1.7
P2.0
123456789P2.110P2.211CLKOUT/P2.312RESOUT13ALE14PSEN15RD16WR17READY18EA19FLT20RES21OSC022OSC123GND24NMI25HOLD/P2.426HLDA/P2.527TXC/P2.628RXC/P2.729TXD/P3.030RXD/P3.13164-Pin Plastic QFP
54AGND55VREF56VDD5/30
¡ SemiconductorMSM66201/66P201/66207/66P207
PIN CONFIGURATION (TOP VIEW) (Continued)
52P4.2/PWM051P4.1/TM1CK50P4.0/TM0CK49NC58P5.0/AI057P4.7/TRNS356P4.6/TRNS255P4.5/TRNS154P4.4/TRNS053P4.3/PWM148P3.7/TM3IO47P3.6/TM2IO46P3.5/TM1IO45P3.4/TM0IOAI3/P5.361AI4/P5.462AI5/P5.563AI6/P5.664AI7/P5.765AGND66VREF67VDD68VDD1AD0/P0.02AD1/P0.13AD2/P0.24AD3/P0.35AD4/P0.46AD5/P0.57AD6/P0.68AD7/P0.7944P3.3/INT160P5.2/AI259P5.1/AI143P3.2/INT042P3.1/RXD41P3.0/TXD40P2.7/RXC39P2.6/TXC38P2.5/HLDA37P2.4/HOLD36NMI35GND34GND33OSC132OSC031RES30FLT29EA28READY27WRA8/P1.010A9/P1.111A10/P1.212A11/P1.313A12/P1.414A13/P1.515A14/P1.616A15/P1.717NC18P2.019P2.120P2.221CLKOUT/P2.322RESOUT23ALE24PSEN25NC : No-connection pin68-Pin Plastic QFJ (PLCC)
RD266/30
¡ SemiconductorMSM66201/66P201/66207/66P207
PIN DESCRIPTION
SymbolP0.0–P0.7/AD0–AD7
TypeI/O
Description
P0: 8-bit input-output port. Each bit can be assigned to input or output.
AD: Outputs the lower 8 bits of program counter during external program memory fetch, and receives the addressed instruction under the control of PSEN. This pin also outputs the address and outputs or inputs data during an external data memory access instruction, under the control of ALE, RD, and WR. P1:8-bit input-output port. Each bit can be assigned to input or output.
A:Outputs the upper 8 bits of program counter (PC8–15) during external program memory fetch. This pin also outputs the upper 8 bits of address during external data memory access instructions.
I/O
P2:8-bit input-output port. Each bit can be assigned to input or output.CLKOUT:Output pin for supplying a clock to peripheral circuits.
HOLD:Input pin to request the CPU to enter the hardware power-down state.HLDA:HOLD ACKNOWLEDGE: the HLDA signal appears in response to the HOLD signal and indicates that the CPU has entered the power-down state.TXC:Transmitter clock input/output pin.RXC:Receiver clock input/output pin.
I/O
P3:8-bit input-output port. Each bit can be assigned to input or output.TXD:Transmitter data output pin.RXD:Receiver data input pin.INT:Interrupt request input pin.
Falling edge trigger or level trigger is selectable.
TM0IO-TM3IO:One of the following signals is output or input.
•Clock at twice the frequency range of the 16-bit timer overflow•Load trigger signal to the capture register input•Setting value output
Whether the signal is input or output depends on the mode.
P4.0/TM0CKP4.1/TM1CKP4.2/PWM0P4.3/PWM1P4.4 – P4.7/TRANS0 – TRANS3P5.0 – P5.7/AI0 –AI7
I/O
P4:8-bit input-output port. Each bit can be assigned to input or output.TM0CK, TM1CK:Clock input pins of timer 0, timer 1.
TRANS:Transition detector.
The input pins which sense the falling edge and set the flag.PWM:16-bit pulse-width modulator output pin.
P1.0–P1.7/A8–A15
I/O
P2.0–P2.2P2.3/CLKOUTP2.4/HOLDP2.5/HLDAP2.6/TXCP2.7/RXCP3.0/TXDP3.1/RXDP3.2/INT0P3.3/INT1P3.4/TM0IOP3.5/TM1IOP3.6/TM2IOP3.7/TM3IO
I
P5:8-bit input port.
AI:Analog signal input pin for A/D converter.
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¡ SemiconductorMSM66201/66P201/66207/66P207
PIN DESCRIPTION (Continued)
SymbolRESOUTALETypeOODescriptionOutputs \"H\" level in the case of internal reset.Reset to\"L\" level by program.Address Latch Enable:The timing pulse to latch the lower 8 bits of the address output from port 0 when the CPU accesses the external memory.The strobe pulse to fetch to external program memory.PSENRDWRREADYEAFLTRESOSC0OSC1NMIVREFAGNDVDDGNDOOOIIIIIOI————Program Strobe Enable:Output strobe activated during a bus read cycle.Used to enable data onto the bus from the external data memory.Output strobe during a bus write cycle.Used as write strobe to external data memory.Used when the CPU accesses low-speed peripherals.Normaly set to \"H\" level.If set to \"L\" level, the CPU fetches the code from external program memory.If FLT is \"H\" level, ALE, WR, RD, PSEN are set to \"H\" level when reset.If FLT is set to \"L\WR, RD, PSEN are set to floating level when reset.RESET input pin.Basic clock oscillation pin.Basic clock oscillation pin.Non-maskable interrupt input pin (falling edge).Reference voltage input pin for A/D converter.Ground for A/D converter.System power supply.Ground.8/30
¡ SemiconductorMSM66201/66P201/66207/66P207
REGISTERS
Accumulator
Control Register (CR)
Pointing Register (PR)
Index Register 1Index Register 2Data PointerUser Stack PointerLocal Register
150ACC15
0
PSW
Bit 15 : Carry flag (CY)Bit 14 : Zero flag (ZF)
Bit 13 : Half carry flag (HC)Bit 12 : Data descriptor (DD)
Bit 8 : Master interrupt priority flag (MIP)Bit 9,5,4: User flag (MIP)
Bit 2-0 : System control base 2-0 (SCB2-0)150
PCLRBSSP
150X1X2DPUSP7070ER0R1R0ER1R3R2ER2R5R4ER3R7R69/30
¡ SemiconductorMSM66201/66P201/66207/66P207
SFR
Address(HEX)00000001000200030004I0005I000600070010I00110012I001300180019001A001B001CI0020002100220023002400250026I00280029002A002C002D002E002F00300031003200330034003500360037System stack printerLocal register baseProgram status wordAccumulatorStandby control registerWatchdog timerPeripheral control registerStop code acceptorInterrupt request registerInterrupt enable registerExternal Iinterrupt control registerPort 0 data registerPort 0 mode registerPort 1 data registerPort 1 mode registerPort 2 data registerPort 2 mode registerPort 2 secondary function control registerPort 3 data registerPort 3 mode registerPort 3 secondary function control registerPort 4 data registerPort 4 mode registerPort 4 secondary function control registerPort 5Timer 0 counterTimer 0 registerTimer 1 counterTimer 1 registerNameSymbolSSP(ASSP)LRB(ALRB)PSWL(APSW)R/W8/16-bitOperationResetFFHFFHundefinedR/W8/16C8H0CH00H00HF8HPSWHACCSBYCONWDTPRPHFSTPACPIRQ8/16IEEXICONP0P0IOP1P1IOP2P2IOP2SFP3P3IOP3SFP4P4IOP4SFP5TM0TMR0R/WTM1TMR116R8R/WWR/WW800H/WDTis stoppedFDH\"0\"00H00H00H00HFCHundefined00Hundefined00Hundefined00H07Hundefined00H00Hundefined00H00H—00H00H00H00H00H00H00H00HNote:A I mark in the address column indicates that there is a bit that does not exist in the
register.
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¡ SemiconductorMSM66201/66P201/66207/66P207
SFR (Continued)
Addres(HEX)00380039003A003B003C003D003E003F00400041004200430046I00480049004AI004C004D004EI0050I0051005400550056I0058I0059I0060I0061Timer 2 counterTimer 2 registerTimer 3 counterTimer 3 registerTimer 0 control registerTimer 1 control registerTimer 2 control registerTimer 3 control registerTransition detector registerSerial port transmission baud rate generator counterSerial port transmission baud rate generator registerSerial port transmission baud rate generator control registerSerial port receiving baud rate generator counterSerial port receiving baud rate generator registerSerial port receiving baud rate generator control registerSerial port transmission mode control registerSerial port transmission data buffer registerSerial port receiving mode control registerSerial port receiving data buffer registerSerial port receiving error registerA/D scan mode registerA/D select mode registerA/D conversion result register 0NameAbbreviatedNameR/W8/16-bitOperationReset00H00H00H00H00H00H00H00H00H00HTM2TMR216TM3TMR3TCON0TCON1TCON2TCON3TRNSITSTTMSTTMRSTTMCSRTMSRTMRSRTMCSTCONSTBUFSRCONSRBUFSRSTATADSCANADSELADCR0R8/16R/WWR/WR8R/W00H00Hundefined00H00H0CH00H00H0EH80Hundefined00HundefinedF0H80HA0HundefinedNote:A I mark in the address column indicates that there is a bit that does not exist in the
register.
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¡ SemiconductorMSM66201/66P201/66207/66P207
SFR (Continued)
Address(HEX)0062I00630064I00650066I00670068I0069006AI006B006CI006D006EI006F007000710072007300740075007600770078007A
Name
A/D conversion result register 1A/D conversion result register 2A/D conversion result register 3A/D conversion result register 4A/D conversion result register 5A/D conversion result register 6A/D conversion result register 7PWM 0 counterPWM 0 registerPWM 1 counterPWM 1 registerPWM 0 control registerPWM 1 countrol register
AbbreviatedName
R/W
8/16-bitoperation
Reset
ADCR1ADCR2ADCR3
R
ADCR4ADCR5ADCR6ADCR7PWMC0PWMR0PWMC1PWMR1PWCON0PWCON1
8
R/W
00H00H00H00H00H00H00H00H00H00H
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undefined
Note:A I mark in the address column indicates that there is a bit that does not exist in the
register.
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¡ SemiconductorMSM66201/66P201/66207/66P207
ADDRESSING MODES
The MSM66201/66207 provides independent 64K-byte data and 64K-byte program space withvarious types of addressing modes. These modes are shown below, for both RAM (for data space)and ROM (for program space).
1.RAM Addressing Modes (for data space)1.1Register Direct Addressing
ExampleRORDPDP1.2
Displacement Addressinga)Zero Page
ExampleLA,18HSFR0000H0018Hb)Direct Page
ExampleSTA,off 10HRAMxx00Hxx10H1.3
Pointing Register (PR) Indirect Addressinga)Data Point (DP) Indirect
ExampleSLL[DP]RAMDPb)User Stack Pointer (USP) Indirect
ExampleSRL10H[USP]USPRAM–128 to +12713/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
c)Index Register (X1, X2) Indirect
ExampleINC300H[X1]X1RAM0 to 655351.4Immediate Addressing
ExampleMOVSSP,#27FH2.ROM Addressing Modes (for program space)2.1Direct Addressing
ExampleLC A,200HROM0200H2.2
Simple Indirect Addressinga)Local Register Indirect
ExampleLCA,[ER0]ROMER0b)Pointing Register Indirect1)Data Pointer (DP) Indirect
ExampleLCA,[DP]ROMDP2)User Stack Pointer (USP) Indirect
ExampleLCA,[USP]ROMUSP14/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
3)
Index Register (X1, X2) Indirect
ExampleLCA,[X1]ROMX1c)System Stack Pointer (SSP) Indirect
ExampleLCA,[SSP]ROMSSPd)Local Register Base (LRB) Indirect
ExampleLCA,[LRB]ROMLRBe)RAM Indirect
ExampleJA, [0C0H]RAM0C0HROM2.3
Double Indirect Addressing
a)Data Pointer (DP) Double Indirect
ExampleJ[[DP]]RAMROMDPb)User Stack Pointer (USP) Double Indirect
ExampleLCA, [–2 [USP]]USPRAMROM–128 to +12715/30
¡ Semiconductor
MSM66201/66P201/66207/66P207
c)Index Register (X1, X2) Double Indirect
ExampleLCA, [10000H [x1]]X1RAMROM0 to 655352.4
Indirect Addressing with 16-bit Offseta)Pointing Register Indirect1)Data Pointer (DP) Indirect
ExampleLCA, [100H [DP]]DPROM0 to 655352)User Stack Pointer (USP) Indirect
ExampleLCA, [100H [USP]]USPROM0 to 655353)Index Register (X1, X2) Indirect
ExampleLCA, [100H [X1]]X1ROM0 to 65535b)RAM Indirect
ExampleLCA, [2000H [80H]]RAM80HROM0 to 6553516/30
¡ SemiconductorMSM66201/66P201/66207/66P207
MEMORY MAPS
Program Memory Space
0000H0000HVectorTableArea(40 bytes)VCALTableArea(16 bytes)InternalROM Area0027H0028H7FFFH *ExternalMemory0037H0038HFFFFH7FFFH ** MSM66201 : 3FFFHData Memory Space
0000H007FH0080H00BFH00C0H00FFH0100H0000HSFR AreaPR AreaSpecialFunctionRegistorsPORT, A/DC,TIMER, PWM,etc....007FH0080HPR0PR1PR2PR3PR4PR5PR6PR700BFH00C0HZeroPageInternalRAMArea80828486X1X2DPUSP(Low Order)(High Order)047FH *ExternalMemolyAreaFFFFH047FH ** MSM66201 : 027FH 17/30
¡ SemiconductorMSM66201/66P201/66207/66P207
ABSOLUTE MAXIMUM RATINGS
ParameterSupply VoltageInput VoltageOutput VoltageAnalog Ref. VoltageAnalog Input VoltagePower DissipationStorage TemperatureSymbolVDDVIVOVREFVAI64-pin shrink DIPPDTSTGTa=85°Cper Package(Ta=25°C)ConditionRating–0.3 to 7.0–0.3 to VDD+0.3GND=AGND=0V–0.3 to VDD+0.3–0.3 to VDD+0.3–0.3 to VREF9305651120–55 to +150mW°C64-pin QFP68-pin QFJ—VUnitRECOMMENDED OPERATING CONDITIONS
ParameterSupply VoltageMemory Hold VoltageOperating FrequencyAmbient TemperatureFan OutSymbolVDDVDDHfOSCTaNConditionfOSC £ 10MHzfOSC = 0HzVDD = 5V ±10%—MOS loadTTL loadP0P1, P2, P3, P4Range4.5 to 5.52.0 to 5.50 to 10–40 to +852021—UnitVMHz°C18/30
¡ SemiconductorMSM66201/66P201/66207/66P207
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter\"H\" Input Voltage 1, 3, 6\"H\" Input Voltage 5, 7\"H\" Input Voltage 8\"H\" Input Voltage 2\"L\" Input Voltage 1, 2, 3, 6\"L\" Input Voltage 5, 7\"L\" Input Voltage 8\"H\" Output Voltage 1, 4\"H\" Output Voltage 2\"L\" Output Voltage 1, 4\"L\" Output Voltage 2Input Leakage Current 3, 6, 7Input Current 5Input Current 8\"H\" Output Current 1\"H\" Output Current 2\"L\" Output Current 1\"L\" Output Current 2Output Leakage Current 1, 2, 4Input CapacitanceOutput CapacitanceAnalog Reference Power Supply CurrentCurrent Consumption(during STOP) *Current Consumption(during HALT)Current ConsumptionIOHVO = 2.4VIOLILOCICOIREFIDDSIDDHIDDVO = VDD/0Vf = 1MHzTa = 25°CA/D in operationA/D stoppedVDD = 2V—fOSC = 10MHzNo LoadIIH/IILVI = VDD/0VVOHVOLIO = –400mAIO = –200mAIO = 3.2mAIO = 1.6mAVIL—SymbolCondition(VDD = 5V ± 10%, Ta = –40 to +85°C) Min.2.44.04.23.6–0.3–0.3–0.34.24.2—————–2–1105————————**—Typ.———————————————————570.30.50.21682030Max.VDD+0.3VDD+0.3VDD+0.3VDD+0.30.80.80.4——0.40.41/–11/–2010/–10————±2——2101010010153540UnitVIH—VmAmAmApFmAmAmA—**—mANote:1
2345678***Applied to P0
Applied to P1, P2, P3 and P4Applied to P5
Applied to ALE, PSEN, RD, WR and RESOUTApplied to RES and NMIApplied to READY and EAApplied to FLTApplied to OSC0
VDD or GND for ports serving as the input pin. No load for any other.Applied to MSM66P201/66P207
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¡ SemiconductorAC Characteristics
•External program memory control
ParameterClock (OSC) PulseALE Pulse WidthPSEN Pulse WidthPSEN Pulse Delay TimeLow Address Setup timeLow Address Hold TimeHigh Address Delay TimeHigh Address Hold TimeInstruction Setup TimeInstruction Hold TimeSymboltfWtAWtPWtPADtAAStAAHtAADtAPHtIStIHCL = 50pFCondition—MSM66201/66P201/66207/66P207
(VDD=5V±10%, Ta=–40 to +85°C)Min.Max.Unit503tfW–204tfW–20tfW–202tfW–35tfW–20tfW–20tfW–201000———tfW+202tfW+20tfW+40tfW+40tfW+40—nstfW–20•External data memory control
ParameterClock (OSC) PulseALE Pulse WidthRD Pulse WidthWR Pulse WidthRD Pulse Delay TimeWR Pulse Delay TimeLow Address Setup TimeLow Address Hold TimeHigh Address Setup TimeHigh Address Hold TimeHigh Address Hold TimeMemory Data Setup TimeMemory Data Hold TimeData Delay TimeData Hold TimeSymboltfWtAWtRWtWWtRADtWADtAAStAAHtAADtARHtAWHtMStMHtDDtDHCL = 50pFCondition—(VDD=5V±10%, Ta=–40 to +85°C)Min.Max.Unit503tfW–204tfW–204tfW–20tfW–20tfW–202tfW–35tfW–20tfW–20tfW–20tfW–201000tfW–20tfW–20————tfW+20tfW+202tfW+20tfW+40tfW+40tfW+40tfW+40—tfW–20tfW+40tfW+40ns20/30
¡ SemiconductorMSM66201/66P201/66207/66P207
CLKt∆WALEtAWPSENtPADt∆WtPWINST0-7AD0-7PC0-7tAAStAAHPC8-15tAADtIStIHA8-15tAPHRDtRADtRWDIN0-7tMSRAP8-15tMHAD0-7RAP0-7tAAStAAHA8-15tAADWRtWADtAPHtWWDOUT0-7AD0-7RAP0-7tAAStAAHtDDRAP8-15tAADtDHA8-15tAWH21/30
¡ Semiconductor• Serial port controlMaster mode
ParameterClock (OSC) Pulse WidthSerial Clock Pulse WidthOutput Data Setup TimeOutput Data Hold TimeInput Data Setup TimeInput Data Hold TimeSymboltfWtSCKWtSTMXStSTMXHtSRMXStSRMXHCL=50pFCondition——MSM66201/66P201/66207/66P207
(VDD=5V±10%, Ta=–40 to +85°C)Min.508tfW8tfW+406tfW–202tfW+1050Max.——————nsUnitSlave mode
ParameterClock (OSC) Pulse WidthSerial Clock Pulse WidthOutput Data Setup TimeOutput Data Hold TimeInput Data Setup TimeInput Data Hold TimeSymboltfWtSCKWtSTSXStSTSXHtSRSXStSRSXHCL=50pFCondition——(VDD=5V±10%, Ta=–40 to +85°C)Min.508tfW6tfW+406tfW–20100100Max.——————nsUnit22/30
¡ SemiconductorMSM66201/66P201/66207/66P207
OSCt∆Wt∆WSCKtSCKWtSCKWSDOUT(TXD)tSTMXHtSTMXSSDIN(RXD)ValidtSRMXHValidtSRMXSSCKtSCKWtSCKWSDOUT(TXD)tSTSXHtSTSXSSDIN(RXD)ValidtSRSXHValidtSRSXS23/30
¡ Semiconductor
A/D Converter Characteristics• Operating range
ParameterPower Supply VoltageAnalog Reference VoltageAnalog Input VoltageAnalog Reference Power Voltage ResistanceOperating TemperatureSymbolVDDVRVAIRRTopVAG = GND = 0VConditionfOSC £ 10MHzMSM66201/66P201/66207/66P207
Min.4.54.5VAG—–40Typ.———16—Max.5.5VDDVR—+85UnitVkW °CVDD = 5V ± 10%• A/D Converter accuracy Normal operation mode
ParameterResolutionAbsolute ErrorRelative ErrorZero Point ErrorFull Scale ErrorDifferential Linearity ErrorCrosstalkSymbolnEAEREZEFEDECCondition(VDD=5V±10%, fOSC=10MHz, Ta=–40 to +85°C)Min.*———0–1.0————————±0.5Typ.*——————±0.510+3.0–3.5Max.*10+2.0–3.5UnitBitSee the —recommended —circuit.VR=VDD—VAG=GND=0VAnalog input source 0impedance –0.5£5kWOne channel —conversion time —tC=64ms±1.5+3.0–3.5+3.0—±1.0+2.0–3.5+2.0—LSB*
VDD=5V, Ta=25°C
HALT/HOLD operation mode
ParameterResolutionAbsolute ErrorRelative ErrorZero Point ErrorFull Scale Error
Differential Linearity ErrorCrosstalk
Symbol
nEAEREZEFEDEC
Condition
(VDD=5V±10%, fOSC=10MHz, Ta=–40 to +85°C)Min.
*———+0.5–1.5——
——————±0.5Typ.
*——————±0.5
10
+2.0
–3.5Max.
*10
+1.0–2.0UnitBit
See the —recommended
—circuit.
VR=VDD—VAG=GND=0V
Analog input source +0.5
impedance
–1.0£5kW
One channel —conversion time
—tC=64ms
±1.0+2.0–3.5+2.0—
±0.5+1.0–2.0+1.0—
LSB
*
VDD=5V, Ta=25°C
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¡ Semiconductor• Recommended circuit
MSM66201/66P201/66207/66P207
ReferenceVoltage+0.147 mF mFVREFVDD+0.147 mF mF+5V–+Analog InputRIAI0-7GND0.1 mFAGND0V• A/D Converter conversion characteristics 1
Conversion Code~RI (Analog input source impedance) £ 5kW[HEX]3FFEFMAX000EZMINEZMAXAnalog InputEFMINIdeal Conversion (center line)Actual Conversion widthActual Conversion (center line)VREF[V]Conversion Characteristics Diagram 1
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¡ SemiconductorMSM66201/66P201/66207/66P207
Absolute error (EA)
The absolute error indicates a difference between actual conversion and ideal conversion,excluding a quantizing error. The absolute error of the A/D converter gets larger as itapproaches the zero point or full scale. (Refer to Conversion Characteristics Diagram 1.)Relative error (ER)
The relative error indicates a deviation from a line which connects the center point of the zeropoint conversion width with that of the full scale conversion width, excluding a quantizingerror.
The relative error of this A/D converter is almost due to a differential linearity error.Zero point error (Ez) and full scale error (EF)
The zero point error and full scale error indicate a difference between actual conversion andideal conversion at the zero point and full scale, respectively. (Refer to ConversionCharacteristics Diagram 1.)A/D Converter Conversion Characteristics 2 (temperature characteristics)
[HEX]3FF–40°C+85°CConversion Code[LSB]+25°C+4ESDifferentialLinearity+3+2ES+1ES000EtaAnalog Input[V]0–40During normal operationDuring HALT+85Temparature Ta[°C]Conversion Characteristics
Diagram 2-1
Differential linearity error (ED)
Conversion Characteristics
Diagram 2-2
The differential linearity error indicates a difference between the actual conversion width(actual step width) and ideal value (1LSB).
With this A/D converter, a voltage for actual conversion is shifted and the inclination of avoltage is changed, with changes of temperature (see Conversion Characteristics Diagram 2-1). Specifications described in the foregoing tables are established from Eta shown inConversion Characteristics Diagram 2-1 (ED=Eta–1LSB). Conversion Characteristics Diagram2-2 shows temperature characteristics of differential linearity of Es in Conversion CharacteristicsDiagram 2-1.
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¡ SemiconductorMSM66201/66P201/66207/66P207
PACKAGE DIMENSIONS
(Unit : mm)SDIP64-P-750-1.78Package materialLead frame materialPin treatmentSolder plate thicknessPackage weight (g)Epoxy resinCu alloySolder plating5 mm or more8.70 TYP.Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).
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¡ SemiconductorMSM66201/66P201/66207/66P207
(Unit : mm)QFP64-P-1414-0.80-BKMirror finishPackage materialLead frame materialPin treatmentSolder plate thicknessPackage weight (g)Epoxy resin42 alloySolder plating5 mm or more0.87 TYP.Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).
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¡ SemiconductorMSM66201/66P201/66207/66P207
(Unit : mm)QFJ68-P-S950-1.27Mirror finishPackage materialLead frame materialPin treatmentSolder plate thicknessPackage weight (g)Epoxy resinCu alloySolder plating5 mm or more4.50 TYP.Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).
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¡ SemiconductorMSM66201/66P201/66207/66P207
(Unit : mm)
ADIP64-C-750-1.78Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, whichare very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for theproduct name, package name, pin number, package code and desired mounting conditions(reflow method, temperature and times).
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