专利名称：Method And Apparatus For Cooling
Electronics
发明人：Edmunds, Howard,McFalls, Richard Kenneth申请号：EP09176384.7申请日：20091118公开号：EP2192827A2公开日：20100602
专利附图：
摘要：Embodiments of the present disclosure provide for methods and devices forimproving the heat dissipating properties of a heatsink (10) to provide increased coolingfor electronic equipment, such as power converters (52). In one embodiment, a heatsink
(10) includes at least one fluid cooled portion (20) and at least one heat pipe (24)disposed adjacent to the fluid cooled portion (20). The heat pipe (24) improves theconduction of heat away from heat sources.
申请人：General Electric Company
地址：1 River Road Schenectady, NY 12345 US
国籍：US
代理机构：Bedford, Grant Richard
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